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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering) by Lau, John(December 1, ) Hardcover [John Lau] on Amazon .com.
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects
This is an excellent reference book for students in senior level or graduate school to understand the advanced packaging related knowledge, including reliability, and a useful tool for engineers in their work on advanced packaging design and analysis. The book covers a wide spectrum with focus on basic concepts and case studies for various advanced electronic and photonic packaging products. Handling 3D packaging reliability is always much more challenging compared to the 2D packaging solutions.
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